엘오티베큠

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随着半导体的直接化和高度化，实现高质量、精细的薄膜至关重要

真空是沉积的关键要素, 可用于在表面分析和特性评估中沉积出色的薄膜.
干式真空泵是必需的, 而不是选择

XD Series

  • Pumping Speed
    • 1,200 ~1,800 ㎥/hr
    • 20,000 ~ 30,000 LPM
  • Ultimate Pressure
    • ≤ 5.0 x 10-3
    • ≤ 6.6 x 10-1

HD Series

  • Pumping Speed
    • 120 ~ 9,000 ㎥/hr
    • 2,000 ~ 150,000 LPM
  • Ultimate Pressure
    • ≤ 3.0 x 10-2 ~ 5.0 x 10-1 Torr
    • ≤ 3.9 x 10+0 ~ 6.6 x 10-1 Pa

DD Series

  • Pumping Speed
    • 100 ~ 6,000 ㎥/hr
    • 1,700 ~ 100,000 LPM
  • Ultimate Pressure
    • ≤ 5.0 x 10-3
    • ≤ 6.6 x 10-1
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